Applied Materials, IME to set up joint facility

Applied Materials, IME to set up joint facility
By Rachel Kelly | Posted: 13 April 2011 1737 hrs

SINGAPORE: Global manufacturing solutions provider, Applied Materials, and Singapore's Institute of Microelectronics (IME) are to set up an Advanced Packaging Center.

Applied Materials and IME - a research institute under the Agency for Science, Technology and Research (A*STAR) - Wednesday signed a research collaboration agreement for the joint facility which will develop new tools and integration schemes for growing wafer-level packaging market.

Located in Singapore's Science Park II, the Center will have a full line of Wafer Level Packaging (WLP) processing equipment and will conduct research in semiconductor hardware, process, and device structures.

Mr Lim Chuan Poh, Chairman of A*STAR, said, "The Center leverages the deep R&D capabilities in 3D-TSV, built by IME over the years, to support advanced packaging tool development for Applied Materials to meet the unique needs of the company and our economy. The setting up of this Center will help advance Singapore's aspiration to be a global R&D hub and Asia's Innovation Capital."

A signing ceremony for the collaboration was officiated by Singapore's Minister for Trade and Industry, Mr Lim Hng Kiang.

- CNA/cc

- wong chee tat :)